The so-called Wintel era is over with no CPU or OS vendors to be able to dominate the PC, tablet PC or handset markets as they did before, according to Asustek chairman Jonney Shih. The breakup of the Wintel alliance offers a brand new opportunity for system vendors to thrive again in the IT market, Shih said.
Shih pointed out that system vendors, which have innovations in design, capabilities in technology R&D, and are closer to the market, will be able to achieve success in the new IT era. Asustek is currently learning from vendors such as Apple and Sony, and is aiming to own a market position within the new IT era, in which the boundaries between the notebook, tablet PC and handset markets are already turning blurry.
Although the rise of tablet PCs is expected to provide system vendors opportunities, it may also significantly reshuffle the ranking of the whole IT market.
Commenting on Acer's recent downward performance, Shih pointed out that Asustek already improved its inventory management system after experiencing the financial crisis in the fourth quarter of 2008, and its retail channel partners all have healthy inventory levels. Asustek is currently checking its downstream partners' inventory levels every Thursday to ensure their supply management.
For the future, company president and CEO Jerry Shen estimates that the company's third quarter performance will be stronger than the second with the IT market in 2011 to return to its usual pattern of having stronger sales in the second half than the first.
Friday, June 10, 2011
Thursday, June 9, 2011
TSMC reiterates revenue target for 2011
Taiwan Semiconductor Manufacturing Company's (TSMC) target of 20% growth in 2011 consolidated revenues remains unchanged, according to company chairman and CEO Morris Chang.
Chang also reiterated that revenues for the global semiconductor industry are set to increase 5% this year, while the dedicated foundry business will see a larger 12% increase.
Chang said he expects smartphones and tablet PCs to spur demand for semiconductors in 2011, and TSMC will definitely be a beneficiary of the trend.
In addition, Chang revealed that the revenue share of TSMC's 45nm and below processes will continue growing in the second half of 2011. With its lead in technology and advanced process capacity, Chang believes TSMC will see its global foundry market share expand in 2011.
Chang made the remarks at TSMC's annual general shareholders meeting on June 9.
TSMC's shareholders approved a cash dividend per share of NT$3 for 2011, and the transfer of the company's solar business and solid state lighting business into two new TSMC wholly-owned companies.
Chang also reiterated that revenues for the global semiconductor industry are set to increase 5% this year, while the dedicated foundry business will see a larger 12% increase.
Chang said he expects smartphones and tablet PCs to spur demand for semiconductors in 2011, and TSMC will definitely be a beneficiary of the trend.
In addition, Chang revealed that the revenue share of TSMC's 45nm and below processes will continue growing in the second half of 2011. With its lead in technology and advanced process capacity, Chang believes TSMC will see its global foundry market share expand in 2011.
Chang made the remarks at TSMC's annual general shareholders meeting on June 9.
TSMC's shareholders approved a cash dividend per share of NT$3 for 2011, and the transfer of the company's solar business and solid state lighting business into two new TSMC wholly-owned companies.
Acer places orders for 80,000 Z series APUs from AMD for tablet PCs
Acer has recently placed orders for 80,000 Z series APUs from AMD for use in tablet PCs, targeting the enterprise market, according to sources from upstream component makers. However, both Acer and AMD did not confirm the orders.
In addition to Acer, Micro-Star International (MSI) is also developing tablet PC models using AMD's APU.
Since Google Android 3.0 currently still has issues which need to be resolved, while the next-generation Android operating system codenamed Ice Cream Sandwich will not appear until the end of 2011, some tablet PC vendors have decided to launch Windows 7-based tablet PCs targeting the enterprise market to maintain their shipments.
Since Intel's Oak Trail-based Atom processor is higher in both price and power consumption, several notebook vendors have already started considering AMD's platform. In addition to Acer and MSI, some vendors have also started inquiring about AMD's Z series APU.
AMD's Z series APU is produced through Taiwan Semiconductor Manufacturing Company's (TSMC's) 40nm process and is already shipping, targeting the Windows-based tablet PC market, noted the sources adding that they expect shipments of Z series APUs to reach at least 500,000 units in the second half of 2011, creating strong pressure on Intel's Oak Trail processor.
In addition to Acer, Micro-Star International (MSI) is also developing tablet PC models using AMD's APU.
Since Google Android 3.0 currently still has issues which need to be resolved, while the next-generation Android operating system codenamed Ice Cream Sandwich will not appear until the end of 2011, some tablet PC vendors have decided to launch Windows 7-based tablet PCs targeting the enterprise market to maintain their shipments.
Since Intel's Oak Trail-based Atom processor is higher in both price and power consumption, several notebook vendors have already started considering AMD's platform. In addition to Acer and MSI, some vendors have also started inquiring about AMD's Z series APU.
AMD's Z series APU is produced through Taiwan Semiconductor Manufacturing Company's (TSMC's) 40nm process and is already shipping, targeting the Windows-based tablet PC market, noted the sources adding that they expect shipments of Z series APUs to reach at least 500,000 units in the second half of 2011, creating strong pressure on Intel's Oak Trail processor.
Taiwan market: Social network phone HTC Salsa launched
HTC has launched its mid-range Android phone, the HTC Salsa, in the Taiwan market in cooperation with Chunghwa Telecom (CHT). The device carries a suggested retail price of NT$12,900 (US$449) and is optimized to integrate with Facebook.
The number of Facebook users in Taiwan totals nine million, of which 6.3 million are active users who eventually will be the potential buyers for the Salsa, said Jack Tong, vice president of HTC Asia Pacific.
While maintaining a relatively high share in the local high-end smartphone sector, HTC also aims to boost its share in the mass market segment with the launch of the mid-range Salsa, said Tong, adding that the Salsa will also target students and feature phone users.
The Salsa is powered by an 800 MHz processor and is equipped with a 3.4-inch touchscreen, a built-in 5-megapixel camera, a gravity sensor, a digital compass and an ambient sensor.
The number of Facebook users in Taiwan totals nine million, of which 6.3 million are active users who eventually will be the potential buyers for the Salsa, said Jack Tong, vice president of HTC Asia Pacific.
While maintaining a relatively high share in the local high-end smartphone sector, HTC also aims to boost its share in the mass market segment with the launch of the mid-range Salsa, said Tong, adding that the Salsa will also target students and feature phone users.
The Salsa is powered by an 800 MHz processor and is equipped with a 3.4-inch touchscreen, a built-in 5-megapixel camera, a gravity sensor, a digital compass and an ambient sensor.
Apple becomes largest OEM semiconductor buyer in 2010, says IHS iSuppli
Spurred by booming demand for the iPhone and iPad, Apple in 2010 became the largest buyer of semiconductors among OEMs for the first time ever, according to IHS iSuppli.
Apple in 2010 bought US$17.5 billion worth of semiconductors, a 79.6% increase from US$9.7 billion in 2009. This represented the highest rate of increase among the world's Top 10 OEM semiconductor buyers, allowing Apple to rise up two positions to take the number one rank in 2010, said IHS. Apple in 2009 was the third-largest semiconductor purchaser behind Hewlett-Packard (HP) and Samsung Electronics; it was sixth in 2008.
"Apple's surge to leadership in semiconductor spending in 2010 was driven by the overwhelming success of its wireless products, namely the iPhone and the iPad," said Wenlie Ye, Analyst for IHS. "These products consume enormous quantities of NAND flash memory, which is also found in the iPod. Because of this, Apple in 2010 was the world's top purchaser of NAND flash."
Apple is likely to continue increasing its semiconductor spending during the coming years at an above-average pace, allowing the company to extend its lead over HP, Samsung and other OEMs in 2011 and beyond, IHS believes. In 2011 Apple's semiconductor spending is expected to exceed that of HP by US$7.5 billion, up from US$2.4 billion in 2010.
Apple in 2010 bought US$17.5 billion worth of semiconductors, a 79.6% increase from US$9.7 billion in 2009. This represented the highest rate of increase among the world's Top 10 OEM semiconductor buyers, allowing Apple to rise up two positions to take the number one rank in 2010, said IHS. Apple in 2009 was the third-largest semiconductor purchaser behind Hewlett-Packard (HP) and Samsung Electronics; it was sixth in 2008.
"Apple's surge to leadership in semiconductor spending in 2010 was driven by the overwhelming success of its wireless products, namely the iPhone and the iPad," said Wenlie Ye, Analyst for IHS. "These products consume enormous quantities of NAND flash memory, which is also found in the iPod. Because of this, Apple in 2010 was the world's top purchaser of NAND flash."
Apple is likely to continue increasing its semiconductor spending during the coming years at an above-average pace, allowing the company to extend its lead over HP, Samsung and other OEMs in 2011 and beyond, IHS believes. In 2011 Apple's semiconductor spending is expected to exceed that of HP by US$7.5 billion, up from US$2.4 billion in 2010.
SEMI forecasts 31% rise in equipment spending and 9% manufacturing capacity increase in 2011
SEMI statistics suggests increasing capital expenditure and growing installed semiconductor manufacturing capacity in 2011. Fab construction spending, however, decelerates this year and in 2012.
"2011 is expected to be a record year for fab equipment spending. Since February, some companies have increased capex guidance and, as a result, fab equipment spending should reach an all-time high of about US$44 billion. The spending pace is expected to decline 6% to US$41 billion in 2012, yet will remain the second highest annual level on record," said Christian Gregor Dieseldorff, senior analyst of fab information in the SEMI Industry Research and Statistics group. "However, the number of new volume fabs starting construction is historically low, with potential implications for industry capacity plans in 2012 and beyond."
The SEMI database indicates that 17 new volume fabs, including 13 LED fabs, have a high probability (over 60%) of beginning construction in 2011. Excluding the LED fabs, SEMI predicts only four volume fabs will begin construction this year and another four in 2012. The SEMI fab database also now identifies candidates for investment in the potential transition to manufacturing on 450mm wafers. Sometime in 2012, the industry will likely see initial equipment expenditures for 450mm pilot development. Construction of the first 450 mm ready facilities began in 2010, and more will begin construction this year.
The earthquake in Japan on March 11 may have some short-term effect on utilization rates and capacity output, but will not have a significant impact on installed capacity, SEMI believes.
Installed capacity is expected to increase about 9% in 2011, according to SEMI. In 2010, the growth rate in capacity of foundry fabs surpassed that of memory fabs, and this trend is expected to continue in 2011 as foundry capacity will grow at a faster pace.
"2011 is expected to be a record year for fab equipment spending. Since February, some companies have increased capex guidance and, as a result, fab equipment spending should reach an all-time high of about US$44 billion. The spending pace is expected to decline 6% to US$41 billion in 2012, yet will remain the second highest annual level on record," said Christian Gregor Dieseldorff, senior analyst of fab information in the SEMI Industry Research and Statistics group. "However, the number of new volume fabs starting construction is historically low, with potential implications for industry capacity plans in 2012 and beyond."
The SEMI database indicates that 17 new volume fabs, including 13 LED fabs, have a high probability (over 60%) of beginning construction in 2011. Excluding the LED fabs, SEMI predicts only four volume fabs will begin construction this year and another four in 2012. The SEMI fab database also now identifies candidates for investment in the potential transition to manufacturing on 450mm wafers. Sometime in 2012, the industry will likely see initial equipment expenditures for 450mm pilot development. Construction of the first 450 mm ready facilities began in 2010, and more will begin construction this year.
The earthquake in Japan on March 11 may have some short-term effect on utilization rates and capacity output, but will not have a significant impact on installed capacity, SEMI believes.
Installed capacity is expected to increase about 9% in 2011, according to SEMI. In 2010, the growth rate in capacity of foundry fabs surpassed that of memory fabs, and this trend is expected to continue in 2011 as foundry capacity will grow at a faster pace.
AMD and Nintendo co-announce new gaming device; AMD to reintroduce FX brand
AMD, at Electronic Entertainment Expo (E3), announced its support for Nintendo's newly-announced Wii U system, as a new way to enjoy HD console gaming entertainment. The custom AMD Radeon HD GPU reflects the characteristics of AMD's graphics technology solutions: high-definition graphics support; rich multimedia acceleration and playback; and multiple display support.
AMD custom graphics enable the new Nintendo system to provide exciting, immersive game play and interaction for consumers around the world, said AMD. The AMD custom graphics processor features a modern and rich graphics processing core, allowing the new console to shine with new graphics capabilities.
Meanwhile, AMD also reintroduced the FX brand for PC processors and platforms at the E3. FX-branded products will be geared toward enthusiast PCs and HD entertainment aficionados.
The FX brand is associated with AMD's fastest processors and most powerful platforms, those designed for unrestrained PC performance for the ultimate gaming and HD entertainment experiences. In addition, these processors and platforms drive rich visuals for graphics-intensive applications and high-resolution AMD Eyefinity multi-monitor configurations. The first platform to earn the FX title, the Scorpius platform, will feature the now-available AMD 9-series chipset motherboards and AMD Radeon HD 6000 Series graphics cards, plus the upcoming Zambezi unlocked, native eight-core processor.
AMD custom graphics enable the new Nintendo system to provide exciting, immersive game play and interaction for consumers around the world, said AMD. The AMD custom graphics processor features a modern and rich graphics processing core, allowing the new console to shine with new graphics capabilities.
Meanwhile, AMD also reintroduced the FX brand for PC processors and platforms at the E3. FX-branded products will be geared toward enthusiast PCs and HD entertainment aficionados.
The FX brand is associated with AMD's fastest processors and most powerful platforms, those designed for unrestrained PC performance for the ultimate gaming and HD entertainment experiences. In addition, these processors and platforms drive rich visuals for graphics-intensive applications and high-resolution AMD Eyefinity multi-monitor configurations. The first platform to earn the FX title, the Scorpius platform, will feature the now-available AMD 9-series chipset motherboards and AMD Radeon HD 6000 Series graphics cards, plus the upcoming Zambezi unlocked, native eight-core processor.
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